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Volsun VS-GP Series Silicone Thermal Conductive Pads, A High-Reliability Thermal Management Solution
As electronic devices become increasingly sophisticated, heat dissipation issues directly affect their stability—chip heating, module overheating, and even malfunctions if not properly addressed. Volsun VS-GP Series Silicone Thermal Conductive Pads are specifically designed to solve thermal management pain points in various electronic devices, and have become a "heat dissipation backbone" for stable device operation with their solid performance.
The core advantages of these thermal conductive pads lie in the details:
- Substrate Composition: Silicone substrate + high thermal conductive filler
- Conformability: Flexible texture with strong conformability, capable of filling micro-gaps between heat-generating components and heat dissipation structures, and adapting to irregular surfaces
- Thermal Resistance Control: Eliminates thermal resistance risks caused by air gaps
- Installation Feature: No additional adhesive required, just direct bonding
- Customization Capability: Supports custom sizes according to device requirements
- Adaptation Value: Meets assembly needs of different scenarios
Technical indicators have been fully verified through actual tests, with accurate and reliable data:
- Thermal conductivity covers up to 6.0 W/(m·K), allowing selection based on different heat generation powers;
- Hardness is only 30-70 Shore OO, with excellent flexibility and a compression rate of >50%, which can conform to device deformation without damaging components;
- Breakdown voltage ≥ 8 kV/mm, with outstanding insulation performance to avoid leakage risks while conducting heat;
- Operating temperature range of -40℃ to 200℃, enabling stable operation in a wide temperature range without performance degradation in high or low temperature environments;
- Volume resistivity ≥ 1.0×10¹² Ω·cm, ensuring stable electrical performance;
- Flame retardant grade reaches UL94 V-0, preventing flame spread and improving device safety.
Widely adapted to multiple scenarios from consumer electronics to industrial equipment:
|
Application Scenario |
Adapted Equipment/Components |
Core Advantages |
Pain Points Solved |
|
Consumer Electronics Field |
Mobile phone/computer chips, power adapters |
High thermal conductivity, thin design, insulation safety |
Device lag due to overheating, battery life degradation |
|
Industrial Control Field |
Inverters, servo drives, PLC modules |
Wide temperature range, aging resistance, customized sizes |
Heat dissipation failure in high-temperature environments, poor assembly conformability |
|
New Energy Field |
Charging pile modules, energy storage battery packs |
Flame-retardant safety, high thermal conductivity efficiency |
High-power heat accumulation, potential safety hazards |
|
Communication Equipment Field |
5G base station RF modules, routers |
Low dielectric loss, stable heat dissipation |
Overheating during continuous operation, reduced signal stability |
|
Automotive Electronics Field |
In-vehicle central control, LED headlight driver modules |
High/low temperature resistance, vibration-resistant conformability |
Unstable heat dissipation under extreme working conditions, detachment of bonded surfaces |
Volsun has been deeply engaged in the thermal conductive protection field for many years. With strict production processes and precise performance control, the VS-GP Series Thermal Conductive Pads have become the first choice for thermal management in many enterprises. Whether for low-power consumer electronics or high-power industrial equipment, suitable models can be found.
Choosing a reliable thermal conductive pad is like purchasing a "stability insurance" for the device. Volsun VS-GP Series Thermal Conductive Pads, with their solid performance data and full-scenario adaptation capabilities, provide strong support for the thermal management of electronic devices.
