* High thermal conductivity, low thermal resistance
* Excellent surface wettability and resilience
* Excellent flame retardant
* Multiple thickness selection, wide application range


Item |
Typical Data |
Test Method |
Standard color |
Grey |
Visual |
Density (g/cm3) |
1.9 |
ASTM D792 |
Thickness (mm) |
0.5~5.0 |
ASTM D374 |
Hardness (Shore OO) |
30~70 |
GB/T 531.1-2008 |
Tensile Strength(KPa) |
≥100 |
GB/T 528-2009 |
Elongation at break (%) |
≥25 |
GB/T 528-2009 |
Thermal conductivity (W/m·k) |
1.5 |
ASTM D5470 |
Flame Retardant Rating |
V-0 |
UL94 |
Breakdown Voltage(kV/mm) |
>8 |
ASTM D149 |
Volume resistivity(Ω·cm) |
≥1.0×10^14 |
ASTM D257 |
Compressibility |
>50% |
GB/T 20671.2-2006 |



















Volsun introduces the Thermal Pad Grizzly 24x12 Motherboard Ip 14 Thermal Pad Reusable Silicone Thermal Pad 400x400, a high-performance cooling solution engineered for modern computing demands. This product description details the features, applications, innovations, and technical advantages of the thermal pad, demonstrating why it is the preferred choice for system builders, repair technicians, and enthusiasts seeking superior motherboard cooling and long-term reliability
Product Overview
The Volsun Thermal Pad Grizzly 24x12 Motherboard Ip 14 Thermal Pad Reusable Silicone Thermal Pad 400x400 is designed as a versatile and effective thermal interface material for a wide range of electronic devices. As a reusable silicone pad, it delivers consistent thermal conductivity and mechanical compliance to fill irregular gaps between chips, heat spreaders, and chassis components. Engineered to IP14 protection standards, this IP14 thermal pad provides robust resistance to dust and mechanical ingress while maintaining excellent heat transfer properties critical for motherboard cooling and overall system stability
Key Features
- High Thermal Conductivity: The thermal pad offers efficient heat transfer from hotspots to heat sinks and chassis, improving thermal flow across critical motherboard components. This enables lower operating temperatures and sustained performance for CPUs, VRMs, chipsets, and memory modules
- Reusable Silicone Construction: As a reusable silicone pad, the product retains elasticity and surface conformity after multiple installations. Technicians can reposition or replace modules without sacrificing performance, reducing waste and lowering maintenance costs
- Precise Dimensions: Measuring 24x12 mm segments within a versatile 400x400 mm sheet format, Volsun’s pad suits both small-scale repairs and large-scale assembly workflows. The standardized sizing supports repeatable placement and optimized coverage for motherboard cooling applications
- IP14 Rating: The IP14 thermal pad meets IP14 criteria for protection against solid object ingress greater than 1 mm. This IP14 thermal pad design minimizes particulate infiltration into the pad’s surface and maintains consistent contact with components, supporting long-term thermal performance
- Mechanical Compliance: The silicone matrix offers balanced softness and compressive strength to accommodate uneven surfaces. This reduces mechanical stress on components while ensuring reliable contact pressure—vital for effective motherboard cooling
- Electrical Insulation: The pad provides dielectric isolation, protecting sensitive circuits while enabling close-contact thermal interfaces across power delivery zones and control ICs
- Low Thermal Resistance: With optimized formulation, the thermal pad lowers junction-to-case thermal resistance in many motherboard layouts, enabling more aggressive power envelopes and stable system operation under load
Applications
- Desktop and Server Motherboards: The Volsun thermal pad is ideal for bridging gaps between VRM arrays, memory modules, and heat sinks on motherboards, delivering consistent motherboard cooling across varying form factors
- Laptops and Compact Systems: In confined enclosures where airflow is limited, using a reusable silicone pad improves heat conduction to chassis surfaces or internal heat spreaders, enhancing temperature control
- GPU and Add-in Cards: Custom cooling setups can benefit from the pad’s conform ability when applied between memory chips and aftermarket heat sinks or shrouds
- Repair and Maintenance: Technicians performing component replacements or upgrades will value the reusable nature of the pad, allowing multiple jobs from a single sheet without performance degradation
- Prototyping and R&D: Engineers designing thermal solutions can use the pad for iterative testing, quickly adjusting configurations while maintaining reliable thermal coupling
Innovations and Design Advantages
Volsun’s Thermal Pad Grizzly 24x12 Motherboard Ip 14 Thermal Pad Reusable Silicone Thermal Pad 400x400 incorporates several innovations tailored to the needs of contemporary electronics. The proprietary silicone composite balances thermal conductivity with compressibility, ensuring superior contact area even on rough or warped surfaces. The reusable silicone pad capability reduces single-use materials in repair cycles and prototyping, promoting sustainability without compromising performance
The sheet format at 400x400 offers scalability and efficient material usage in both small shops and production environments. Pre-marked 24x12 mm segmentation allows rapid, repeatable placement for motherboard cooling patterns, minimizing waste and speeding assembly. Because the pad meets IP14 criteria, it is particularly effective in environments where particulate ingress is a concern, helping maintain thermal coupling and reducing maintenance intervals
Technical Advantages
- Long-Term Stability: The silicone base resists drying, cracking, and thermal cycling degradation, preserving thermal performance over repeated heating and cooling cycles. This longevity supports extended service life for system components
- Consistent Thermal Interface: The material’s low thermal resistance and stable compressive properties ensure repeatable performance across installations—key for quality-critical assemblies
- Easy Handling: The pad’s tack-free surface and predictable deformation simplify handling and placement during assembly, reducing installation time and error rates
- Non-Conductive: The electrical insulation reduces the risk of short circuits, allowing closer placement to exposed pads and traces on motherboards and PCBs
- Compatibility: The thermal pad’s formulation is compatible with common heatsink materials and surface finishes, ensuring broad applicability across hardware designs
Performance Benefits for Motherboard Cooling
Effective motherboard cooling is central to system reliability and performance. The Volsun thermal pad enhances heat evacuation from VRMs, chipsets, and memory by filling air gaps that otherwise impede conduction. By improving contact between components and heat sinks or chassis, the IP14 thermal pad contributes to lower core and peripheral temperatures, more stable voltage regulation, and reduced thermal throttling during sustained loads
For system integrators, the reusable silicone pad reduces the need for stockpiling single-use thermal materials and speeds service operations. In high-density server racks or gaming rigs, the pad’s predictable thermal performance enables tighter thermal budgets and more aggressive fan curves calibrated for optimized acoustics and thermal control
User Scenarios
- System builders installing high-power CPUs on compact motherboards can use the pad to bridge VRM arrays to a shared heatsink, improving motherboard cooling and protecting components under load
- Repair shops replacing chipset or power delivery modules benefit from the reusable silicone pad’s ability to be repositioned during test cycles, minimizing material consumption
- OEMs prototyping new designs can iterate thermal layouts quickly by cutting 24x12 sections from the 400x400 sheet, enabling rapid validation of cooling concepts without repeated material purchases
Quality and Compliance
Volsun adheres to rigorous manufacturing and quality assurance processes to ensure each thermal pad sheet meets performance specifications. The IP14 rating reflects attention to ingress protection in handling and use, and the material formulation complies with industry standards for electronic assembly and insulation
The Volsun Thermal Pad Grizzly 24x12 Motherboard Ip 14 Thermal Pad Reusable Silicone Thermal Pad 400x400 combines high thermal conductivity, mechanical compliance, electrical insulation, and reusability into a single, cost-effective solution for motherboard cooling and broader electronic thermal management needs. Whether for desktop builds, compact laptops, GPU cooling, or professional repair and prototyping, this IP14 thermal pad delivers measurable improvements in heat transfer and system reliability while promoting sustainable, repeatable workflows
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