RoHS Compliance Flame Retardant Organic Silicone Rubber Thermal Conductive Pad
Description
VS-GP1501 silicone thermal pads achieve low interfacial thermal resistance at relatively low pressures, with excellent thermal conductivity, thermal stability, flexibility and resilience. Also, it is safe and reliable to use. Applied between the power device and the cooling aluminum sheet or the machine shell, the air can be effectively excluded to achieve good thermal conductivity and filling effect
Features
* Continuous operating temperature：-40℃~+200℃
* High thermal conductivity, low thermal resistance
* Excellent surface wettability and resilience
* Excellent flame retardant
* Multiple thickness selection, wide application range
* Environmental protection standard: RoHS, REACH
Customization is supported, and some sizes are in stock, and free samples can be provided
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Thermal conductivity (W/m·k) |
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Dimensions are customizable and available on request
Instructions
* Clean the surface of the substrate to be installed before use
* Select suitable products based on the dimensions of the installation position
Precautions* The environment should be free of large debris or other pollutants to avoid affecting the installation effect and protective performance of the materials
* The specifications of the product should be similar to the dimensions of the installation position, and the deviation should not be too large
Storage conditions Shelf life
* Storage Temperature: 0℃~40℃
* Relative humidity: RH＜ 80%
* Shelf life: 12 months from the production date
New Energy Vehicle Battery Packs
Suzhou Volsun Electronics Technology Co., Ltd. was founded in 2006. We keep focusing on the R&D, production and sales in insulation, sealing & protection solutions for over 18 years
Quality is our culture. Volsun has a modern quality management system, which has passed a series of quality system certification such as IATF16949, ISO9001 etc
Up to now, Volsun cooperated with customers from 88 countries, we offer suitable sealing, waterproof solutions for some well-know enterprises in communication, Automobile, Power industry etc
Q 1. How long is the payment term
A: We accept T/T 50% deposit and 50% balance against B/L or L/C copy at sight, also accept Western Union, VISA and Paypal
Q 2. What is the normal lead time for product orders
A: The average lead time for prototype/first piece is 7~10 days, if tooling is involved, the lead time for production tooling is 10 days, and the average production time after sample approval is 2-3 weeks
Q 3. What is your standard packaging
A: All goods will be packed in cartons and loaded on pallets. Special packing methods are acceptable when needed
Q 4. Can you tell us the monthly production capacity of your products
A: It depends on the model, we produce more than 1500 tons of rubber materials per month
Q 5. What kind of certificates do you have
A1: We have ISO9001:2015, IATF16949:2016, ISO14001:2015, ISO45001:2018 certified
A2: We have various rubber compounds approved by UL, ROHS and REACH
Q6: How to check the quality of bulk order
A1: We provide pre-production samples to all customers before mass production if needed
A3: We accept third-party inspection, such as SGS, TUV, INTERTEK, BV, etc
Q 9: Can you provide customized service
A: Yes, we accept customization and can produce products in different sizes, packaging, colors according to requirements
Volsun presents a high-performance Thermal Pad designed to meet demanding heat dissipation needs across mobile devices and computing hardware. The Thermal Pad 5mm 6W/mK Thermal Silicone Pad for Cell Phone Thermal Pad for GPU is engineered as a versatile silicone thermal pad that brings consistent, reliable thermal transfer and mechanical resilience. This silicone thermal pad by Volsun is ideal for applications ranging from smartphone processors to discrete graphics cards, delivering exceptional thermal conductivity and durable performance in a slim 0.5mm profile. As a dedicated 6W/mK thermal pad solution, Volsun’s offering addresses thermal management challenges with precision, stability, and material innovation
Product Overview and Key Features
The Volsun Thermal Pad 5mm 6W/mK Silicone Thermal Pad is a premium silicone thermal pad developed to efficiently bridge the gap between heat-generating components and heat spreaders or heat sinks. This 6W/mK thermal pad provides a uniform, compliant interface that minimizes thermal resistance and enhances cooling efficacy for CPUs, phone GPUs, memory modules, and power electronics. The silicone thermal pad has a controlled softness and elasticity that allows it to conform to uneven surfaces, ensuring consistent contact and improved thermal coupling even under repeated assembly and thermal cycling
- High thermal conductivity: Rated at 6W/mK, this 6W/mK thermal pad transfers heat effectively from hot components to cooling solutions
- Ultra-thin 0.5mm thickness: The 0.5mm profile of this thermal silicone pad is specifically tailored for slim spaces in mobile phone assemblies and densely packed GPU components where clearance is limited
- Silicone-based reliability: As a silicone thermal pad, it combines thermal performance with electrical insulation, environmental stability, and long-term resilience
- Excellent conform ability: The silicone thermal pad compresses to fill micro-gaps and uneven surfaces, ensuring optimal interface contact
- Easy to apply and remove: The Volsun thermal pad simplifies manufacturing and repair workflows with clean adhesion properties that resist residue and lifting
- Non-conductive, safe material: The silicone thermal pad maintains electrical isolation while offering high thermal transfer rates, reducing risk in sensitive electronic assemblies
Applications and Use Cases
Volsun’s Thermal Pad 5mm 6W/mK Silicone Thermal Pad is crafted for multiple modern thermal management scenarios. It serves as an effective phone GPU thermal pad for smartphone manufacturers, repair technicians, and aftermarket thermal upgrades. In cell phone thermal pad applications, the thin 0.5mm profile permits precise placement beneath metal shields, heat spreaders, and thermal frames without compromising spacing or mechanical tolerances. For desktop and laptop GPUs, this thermal pad supports memory and power stage cooling, acting as a phone GPU thermal pad analog when compact, low-profile solutions are required
Common applications include:
- Cell phone thermal pad installations around SoC and phone GPU components
- GPU memory and VRAM cooling upgrades and replacements where a 6W/mK thermal pad is needed
- Thermal bridging for M.2 SSDs, power modules, and compact computing boards
- Industrial electronics and embedded systems requiring silicone thermal pad solutions with high thermal conductivity
- Prototyping and production lines where consistent, repeatable thermal interfaces are necessary
Performance Advantages and Technical Innovation
Volsun’s silicone thermal pad achieves a balanced combination of thermal conductivity, mechanical compliance, and manufacturing friendliness. The thermal pad’s 6W/mK rating positions it above conventional low-conductivity gap fillers while remaining easier to apply and less brittle than ceramic-based pads. This 6W/mK thermal pad offers a significant thermal improvement for phone GPU thermal pad replacements, where maximizing heat flow in confined spaces is crucial
Key technological advantages:
- Optimized filler matrix: The silicone thermal pad incorporates thermally conductive fillers that are dispersed to provide uniform conduction paths without compromising flexibility
- Low thermal resistance interface: The 6W/mK thermal pad reduces interface resistance between GPU dies, memory ICs, and heat spreaders, enabling lower operating temperatures and improved performance stability
- Compression set resistance: The silicone formulation resists permanent deformation under repeated load cycles, preserving thermal performance over device lifetimes
- Controlled hardness: Volsun’s thermal pad is engineered to a hardness that balances conform ability with structural integrity so it does not extrude or migrate under mechanical stress
- Environmental durability: The silicone thermal pad withstands thermal cycling, humidity, and aging better than many organic alternatives, maintaining thermal conductivity and physical form
Why Choose Volsun’s Thermal Pad
For engineers, repair professionals, and OEMs seeking a reliable thermal interface, Volsun’s 6W/mK thermal pad presents a compelling choice. As a silicone thermal pad, it combines the safety of electrical insulation with competitive thermal performance. The 5mm thickness is purpose-built for modern mobile and compact GPU assemblies where clearance is at a premium. Choosing Volsun means selecting a product designed for consistent manufacturing application, dependable field performance, and superior thermal management compared to many generic gap fillers
Benefits at a glance:
- Immediate thermal gains when replacing lower-conductivity pads
- Easier assembly and reduced risk of mess compared with thermal pastes
- Lower thermal resistance for phone GPU thermal pad needs and broader electronics thermal management
- Durable performance across a device’s operating life
Installation and Handling Guidelines
To achieve optimal performance from the Volsun thermal pad, proper surface preparation and handling are recommended. Clean contact surfaces with appropriate solvents to remove oils and residues. Cut the silicone thermal pad to size using a sharp blade, ensuring edges are trimmed to match the component footprint. Apply the 6W/mK thermal pad gently between the device and the heatsink or spreader, allowing it to compress to form a full-area contact. Avoid stretching the pad during installation to preserve uniform thickness and compliance. For serviceability, the silicone thermal pad can be removed and replaced with minimal residue, promoting efficient maintenance workflows
Quality Assurance and Specifications
Volsun’s manufacturing adheres to stringent quality controls to ensure consistent thermal conductivity, thickness tolerances, and mechanical properties. Each thermal silicone pad is evaluated to meet specified 0.5mm thickness and 6W/mK thermal conductivity claims, giving designers and technicians confidence in predictable thermal performance. As a phone GPU thermal pad and general-purpose silicone thermal pad, Volsun’s product undergoes stability testing for compression, thermal cycling, and environmental exposure
The Volsun Thermal Pad 5mm 6W/mK Thermal Silicone Pad for Cell Phone Thermal Pad for GPU is a purpose-driven silicone thermal pad engineered to elevate thermal management in compact electronics. Whether upgrading a phone GPU thermal pad, outfitting GPU memory modules, or bridging thermal interfaces in embedded systems, this 6W/mK thermal pad offers measurable improvements in heat transfer, long-term reliability, and installation convenience. Trust Volsun’s silicone thermal pad to deliver the thermal performance and mechanical resilience required by modern electronic devices
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