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mk high thermal conductivity silicone sheet for led driver  power supply cooling-0

Super Soft 6.0 W/mK High Thermal Conductivity Silicone Sheet for LED Driver & Power Supply Cooling

Spu:
10000041521754
Description
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Product Overview

RoHS Compliance Flame Retardant Organic Silicone Rubber Thermal Conductive Pad

Description
VS-GP1501 silicone thermal pads achieve low interfacial thermal resistance at relatively low pressures, with excellent thermal conductivity, thermal stability, flexibility and resilience. Also, it is safe and reliable to use. Applied between the power device and the cooling aluminum sheet or the machine shell, the air can be effectively excluded to achieve good thermal conductivity and filling effect

Features
*  Continuous operating temperature:-40℃~+200℃
*  High thermal conductivity, low thermal resistance
*  Excellent surface wettability and resilience
*  Excellent flame Retardancy
*  Multiple thickness selection, wide application range
*   Environmental protection standard: RoHS, REACH
Support customization, ODM & OEM available

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VR
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PRODUCT SPECIFICATIONS
Item
Typical Data
Test Method
Standard color
Grey
Visual
Density (g/cm3)
1.9
ASTM D792
Thickness (mm)
0.5~5.0
ASTM D374
Hardness (Shore OO)
30~70
GB/T 531.1-2008
Tensile Strength(KPa)
≥100
GB/T 528-2009
Elongation at break (%)
≥25
GB/T 528-2009
Thermal conductivity (W/m·k)
1.5
ASTM D5470
Flame Retardancy Rating
V-0
UL94
Breakdown Voltage(kV/mm)
>8
ASTM D149
Volume resistivity(Ω·cm)
≥1.0×10^14 
ASTM D257
Compressibility
>50%
GB/T 20671.2-2006


Dimensions are customizable and available on request


Instructions
* Clean the surface of the substrate to be installed before use
* Select suitable products based on the dimensions of the installation position

Precautions
* The environment should be free of large debris or other pollutants to avoid affecting the installation effect and protective performance of the materials
* The specifications of the product should be similar to the dimensions of the installation position, and the deviation should not be too large

Storage conditions Shelf life
* Storage Temperature: 0℃~40℃
* Relative humidity: RH< 80%
* Shelf life: 12 months from the production date

Detail Show
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Applications
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GPU/CPU Chip
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New Energy Vehicle Battery Packs
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Heat Dissipation Module
Company Show
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Suzhou Volsun Electronics Technology Co., Ltd. was founded in 2006. We keep focusing on the R&D, production and sales in insulation, sealing & protection solutions for over 20 years


Quality is our culture. Volsun has a modern quality management system, which has passed a series of quality system certification such as IATF16949, ISO9001 etc


Up to now, Volsun cooperated with customers from 88 countries, we offer suitable sealing, waterproof solutions for some well-know enterprises in communication, Automobile, Power industry etc
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Certifications
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Abroad Exhibition
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Las Vagas AAPEX
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Moscow Expo
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Hannover Messe
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Product packaging
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Packing & Loading-1

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Packing & Loading-2

FAQ
Q 1. How long is the payment term
A: We accept T/T 50% deposit and 50% balance against B/L or L/C copy at sight, also accept Western Union, VISA and Paypal

Q 2. What is the normal lead time for product orders
A: The average lead time for prototype/first piece is 7~10 days, if tooling is involved, the lead time for production tooling  is 10 days, and the average production time after sample approval is 2-3 weeks

Q 3. What is your standard packaging
A: All goods will be packed in cartons and loaded on pallets. Special packing methods are acceptable when needed

Q 4. Can you tell us the monthly production capacity of your products
A: It depends on the model, we produce more than 1500 tons of rubber materials per month

Q 5. What kind of certificates do you have
A1: We have ISO9001:2015, IATF16949:2016, ISO14001:2015, ISO45001:2018 certified
A2: We have various rubber compounds approved by UL, ROHS and REACH

Q6: How to check the quality of bulk order
A1: We provide pre-production samples to all customers before mass production if needed
A3: We accept third-party inspection, such as SGS, TUV, INTERTEK, BV, etc

Q 7: Can you provide customized service

A: Yes, we accept customization and can produce products in different sizes, packaging, colors according to requirements


Volsun presents the Super Soft 6.0 W/mK High Thermal Conductivity Silicone Sheet for LED Driver & Power Supply Cooling, a purpose-engineered thermal interface material designed to solve modern heat dissipation challenges in compact electronics. This high-performance thermal silicone sheet delivers a balance of softness, Conformability, and exceptional thermal conductivity, making it ideal for demanding applications such as LED driver cooling and power supply cooling where efficient heat transfer, mechanical compliance, and long-term reliability are paramount.

 

Product Overview and Key Features

The Volsun Super Soft 6.0 W/mK thermal silicone sheet is formulated to provide superior thermal management in confined spaces. With a rated thermal conductivity of 6.0 W/mK, this high thermal conductivity silicone material offers a significant improvement over conventional silicone pads and gap fillers. The sheet’s super soft mechanical properties ensure excellent surface wettability and gap-filling capability, enabling low thermal resistance interfaces between heat-generating components and heat sinks or chassis. Whether retrofitting existing LED driver cooling systems or designing new power supply cooling solutions, this thermal silicone sheet reduces junction temperatures, improves component longevity, and enhances system reliability.

 

Key features:

- High thermal conductivity: 6.0 W/mK performance for rapid heat transfer.

- Super soft formulation: excellent Conformability to uneven surfaces and minimal mechanical stress on components.

- Low thermal impedance: effectively bridges air gaps and microscopic surface roughness.

- Stable across a wide temperature range: retains performance under long-term thermal cycling typical in LED driver cooling and power supply cooling.

- Electrically insulating: safe for proximity to live circuits while providing efficient thermal paths.

- Easy to cut and install: flexible sheets that can be trimmed for custom applications.

 

Technical Advantages and Innovation

Volsun’s high thermal conductivity silicone sheet combines material science advances with practical application-focused design. The innovative filler package and optimized silicone matrix yield a product that can transfer heat at 6.0 W/mK without sacrificing compliance. Many high-conductivity materials trade off flexibility for thermal performance; Volsun’s solution preserves softness while delivering high thermal conductivity silicone performance. This allows the sheet to compensate for tolerances and mechanical tolerances in LED driver cooling assemblies and power supply cooling enclosures, decreasing the need for mechanical clamping and reducing assembly complexity.

 

The thermal silicone sheet’s electrically insulating nature is engineered to keep stray currents isolated while allowing thermal energy to pass efficiently. This reduces risk and increases design freedom for thermal solutions in compact LED driver cooling modules and high-density power supply cooling systems. The material’s stability means that thermal conductivity does not degrade significantly over thermal cycles, ensuring that long-term thermal performance remains predictable for maintenance planning and warranty considerations.

 

Applications and Use Cases

- LED driver cooling: The Super Soft 6.0 W/mK thermal silicone sheet is ideal for bridging the interface between LED drivers and heat-dissipating enclosures or Heatsinks. Its superior Conformability ensures low contact resistance even where mechanical mounting is imperfect, improving LED driver cooling efficiency and reducing hotspot formation.

- Power supply cooling: High-density power supplies and DC-DC converters benefit from efficient thermal paths. The thermal silicone sheet can be used between power modules and chassis or between discreet heat sources and thermal spreaders to improve thermal uniformity and reduce peak temperatures.

- Industrial electronics: Control modules, motor drives, and industrial power controllers often require effective thermal interface materials; Volsun’s product provides both mechanical compliance and high thermal conductivity for these robust environments.

- Telecommunications and data centers: Small form-factor power supplies and remote radio units require compact thermal solutions. The thermal silicone sheet delivers high thermal performance while allowing designers to maintain compactness and reliability.

- Automotive electronics: For in-vehicle LED drivers and power electronics where vibration and mechanical stress are concerns, the sheet’s softness and thermal performance provide secure thermal coupling without stressing components.

 

Performance Benefits

By integrating the Super Soft 6.0 W/mK sheet, designers can expect measurable thermal improvements. Lower operating temperatures extend component life and reduce failure rates in LED driver cooling and power supply cooling applications. Reduced thermal resistance improves heat spreading and lowers the thermal load on point heat sinks, enabling smaller or fewer cooling components and potentially reducing overall system cost and weight. The soft interface reduces mechanical stress and accommodates assembly tolerances, decreasing returns due to mechanical damage during installation.

 

Installation and Handling

The thermal silicone sheet is supplied in convenient sheet form and can be die-cut or trimmed to match custom footprints. Its tacky surface assists initial placement without introducing messy adhesives, and it conforms under light compression to form an effective thermal bridge. For retrofit projects in LED driver cooling applications or power supply cooling upgrades, the sheet simplifies installation and yields immediate thermal benefits. Volsun recommends storing sheets in a dry environment and avoiding prolonged exposure to solvents or extreme contamination prior to installation.

 

Reliability and Safety

Volsun’s formulation emphasizes both thermal reliability and electrical safety. The high thermal conductivity silicone is electrically insulating, flame retardant to common industry standards, and resistant to long-term thermal cycling. This ensures consistent performance throughout product lifecycles in LED driver cooling systems and power supply cooling assemblies, supporting higher mean time between failures (MTBF) and lower maintenance requirements.

 

Design Considerations

When selecting the appropriate thickness and area for the thermal silicone sheet, designers should balance thermal resistance and mechanical compliance. Thinner sections provide lower bulk resistance but may be less tolerant of large gaps; thicker sections improve gap filling but add thermal path length. Volsun offers multiple thicknesses and can support custom sizing to meet specific LED driver cooling and power supply cooling requirements. Engineers are encouraged to model thermal paths and, when possible, validate with thermal imaging and temperature cycling tests during prototyping.

 

Why Choose Volsun

Volsun’s Super Soft 6.0 W/mK thermal silicone sheet reflects deep expertise in thermal materials tailored for electronics cooling. The product’s unique combination of softness and high thermal conductivity silicone performance makes it an effective, low-risk choice for LED driver cooling and power supply cooling challenges. Supported by Volsun’s technical service, designers gain access to material data, handling guidance, and customization options to ensure the right fit for each application.

 

Conclusion

For applications demanding both exceptional thermal transfer and mechanical compliance, Volsun’s Super Soft 6.0 W/mK High Thermal Conductivity Silicone Sheet is an optimal thermal interface material. It helps engineers achieve reliable LED driver cooling and efficient power supply cooling with minimal assembly stress and long-term thermal stability. Combine high thermal conductivity silicone performance with Volsun’s commitment to quality and support to elevate the thermal design of your next generation electronics.

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