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mk thermal potting compound silicone thermal conductive resin potting compound ab glue-0

Silicone Potting Compound

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3.0w/mk Thermal Potting Compound Silicone Thermal Conductive Resin Potting Compound AB Glue

Description

Volsun’s 3.0w/mk Thermal Potting Compound is a high-performance silicone resin potting compound designed to efficiently transfer heat away from electronic components. This AB glue is specially formulated with a thermal conductivity of 3.0w/mk, making it ideal for applications where heat dissipation is critical.

 

The Volsun’s Thermal Potting Compound is easy to mix and apply, making it perfect for both professional and DIY projects. Simply combine the two components in equal parts, mix thoroughly, and pour the compound over the electronic component to create a durable, heat-resistant seal. Once cured, the potting compound forms a protective barrier that shields the electronic components from dust, moisture, and other environmental factors.

 

This silicone thermal conductive resin is highly versatile and can be used in a wide range of applications, including LED lighting, power supplies, automotive electronics, and more. Its low viscosity allows it to easily flow into tight spaces and intricate designs, ensuring optimal coverage and heat transfer. The Volsun’s Thermal Potting Compound is also flame-retardant and has excellent adhesion properties, providing long-lasting protection and performance.

 

Whether you are looking to improve the thermal management of your electronic devices or need a reliable potting compound for your next project, Volsun’s 3.0w/mk Thermal Potting Compound is the perfect solution. With its high thermal conductivity, ease of use, and durability, this AB glue is sure to meet your needs and exceed your expectations.

 

Trust Volsun for all your thermal management needs and experience the difference that quality and performance can make. Upgrade your electronic projects with Volsun’s 3.0w/mk Thermal Potting Compound today and ensure that your devices run cool, efficient, and reliable for years to come

Product Overview

Potting Compound Potting Compound for electronics silicone potting compound

Description
VS-TP2001 is a two-component 1:1 type heat-curing silicone thermally conductive liquid Formable gel material that cures at room temperature or after heating to form an elastic thermally conductive silicone rubber, specially designed for the manufacture of electrical and electronic products and modules, such as high Potting protection of power supply modules, frequency converters, sensors, etc., connection and fixation between automotive electronic devices and PCB, etc

Features
*  Continuous operating temperature:-70℃~+200℃
*  Excellent mechanical properties and extensibility
*  Excellent thermal conductivity and aging resistance
*  Low viscosity, self-leveling, excellent drilling ability
*  Low modulus, low stress, good adhesion to both metals and plastics

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PRODUCT SPECIFICATIONS
Item
Typical Data
Test Method
Mixing ratio
1:1
/
Color - After mixing
Grey
Visual
Viscosity (Component A) @25℃
7000-9000cps
ASTM D2196
Viscosity (Component B) @25℃
7000-9000cps
ASTM D2196
Viscosity (After mixing) @25℃
7000-9000cps
ASTM D2196
Opening hours @25℃
≥60min
/
Curing condition
30min/50℃;20min/100℃
/
Thermal Conductivity
2.0±0.2 W/m·k
ASTM D5470
Hardness
45±5 Shore A
GB/T 531.1-2008
Density
2.8±0.2 g/cm3
GB/T 1033.1-2008
Tensile strength
>0.2MPa
GB/T 528-2009
Elongation at break
>10%
GB/T 528-2009
Flame retardance
V-0
UL94
Breakdown strength
≥10 kV/mm
GB/T 1695-2005
Volume resistivity
≥ 1.0×1013 Ω·cm
GB/T 1692-2008
Applications
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Dimensions

Size
Package
VS-TP2001 - 1kg
Component A: 0.5kg; Component B: 0.5kg
VS-TP2001 - 20kg
Component A: 10kg; Component B: 10kg
VS-TP2001 - 40kg
Component A: 20kg; Component B: 20kg
VS-TP2001 - 80kg
Component A: 40kg; Component B: 40kg
VS-TP2001 0 100kg
Component A: 50kg; Component B: 50kg

Note:Special size and packing are available as request


Instructions
*  A and B components are stirred separately
*  Mixing the well-stirred components A and B according to the ratio of 1:1 (volume ratio/weight ratio can be used) well
*  The mixed compound is poured into the device which need to be sealed, then static curing - Can be cured at room temperature or by heating

Precautions
*  In order to ensure the uniform distribution of fillers, components A and B must be stirred separately before mixing, so that each compounding agent is evenly mixed
*  After A and B are mixed, they will react and cure each other, so they need to be used up after mixing, and they cannot be used twice after mixing and curing
*  When pouring into the protective part, there should be no large debris or other contaminants in the protective part to avoid affecting the mutual adhesion of the material and the object
*  Before the material is fully cured, avoid other objects contacting the material, affecting the appearance and protective
 performance of the material
*  This product should not be in the mouth and eyes. If it accidentally enters the mouth and eyes, rinse it with water in time or go to the hospital for medical treatment.
*  If need high thermal conductivity, vacuum degassing is required before pouring
*  In low temperature environment, the curing time will be extended accordingly
Storage conditions Shelf life
*  The product should be stored in the original packaging, keeping the lid tightly closed to avoid contamination Temperature: 15℃<T<30℃; Relative Humidity: RH<70%
*  Shelf life is 9 months from the date of manufacture

Company Show

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Suzhou Volsun Electronics Technology Co., Ltd. was founded in 2006. We keep focusing on the R&D, production and sales in insulation, sealing & protection solutions for over 18 years. Quality is our culture. Volsun has a modern quality management system, which has passed a series of quality system certification such as IATF16949, ISO9001 etc. Up to now, Volsun cooperated with customers from 88 countries, we offer suitable sealing, waterproof solutions for some well-know enterprises in communication, Automobile, Power industry etc
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Certifications
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Abroad Exhibition
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Las Vagas AAPEX
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Moscow Expo
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Hannover Messe

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