Volsun 1-8W Silicone Thermal Pad for CPU/GPU and Electronic Components Cooling High Voltage ISO9001 Certified

About Product

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RoHS Compliance Flame Retardant Organic Silicone Rubber Thermal Conductive Pad Description VS-GP1501 silicone thermal pads achieve low interfacial thermal resistance at relatively low pressures, with excellent thermal conductivity, thermal stability, flexibility and resilience. Also, it is safe and reliable to use. Applied between the power device and the cooling aluminum sheet or the machine shell, the air can be effectively excluded to achieve good thermal conductivity and filling effect
Continuous operating temperature:-40℃~+200℃
High thermal conductivity, low thermal resistance
Excellent surface wettability and resilience
Excellent flame retardancy
Multiple thickness selection, wide application range
Environmental protection standard: RoHS, REACH
Support customization, ODM & OEM available

 

About Us

Suzhou Volsun Electronics Technology Co., Ltd. was founded in 2006. We keep focusing on the R&D, production and sales in insulation, sealing & protection solutions. Volsun has a modern quality management system, which has passed a series of quality system certification such as IATF16949, ISO9001 etc. Up to now, Volsun cooperated with customers from 88 countries, we offer suitable sealing, waterproof solutions for some well-know enterprises in communication, Automobile, Power industry etc

                     

FAQs

How long is the payment term

We accept T/T 50% deposit and 50% balance against B/L or L/C copy at sight, also accept Western Union, VISA and Paypal

What is the normal lead time for product orders

The average lead time for prototype/first piece is 7~10 days, if tooling is involved, the lead time for production tooling is 10 days, and the average production time after sample approval is 2-3 weeks

What is your standard packaging

All goods will be packed in cartons and loaded on pallets. Special packing methods are acceptable when needed

Can you tell us the monthly production capacity of your products

It depends on the model, we produce more than 1500 tons of rubber materials per month

What kind of certificates do you have

We have ISO9001:2015, IATF16949:2016, ISO14001:2015, ISO45001:2018 certified We have various rubber compounds approved by UL, ROHS and REACH

How to check the quality of bulk order

We provide pre-production samples to all customers before mass production if needed. We accept third-party inspection, such as SGS, TUV, INTERTEK, BV, etc

Can you provide customized service

Yes, we accept customization and can produce products in different sizes, packaging, colors according to requirements

Volsun presents the Volsun 1-8W Silicone Thermal Pad for CPU/GPU and Electronic Components Cooling High Voltage ISO9001 Certified, a purpose-engineered thermal interface solution designed to meet demanding thermal management needs across computing, power electronics and industrial applications. As a product from Volsun, a National High-tech Enterprise founded in 2006 with deep experience in polymer materials R&D, this silicone thermal pad blends proven materials science, manufacturing rigor and application versatility to deliver reliable heat conduction, electrical insulation and long-term stability. This product brief highlights the silicone thermal pad’s features, applications, innovation points and technical advantages, and demonstrates why engineers choose Volsun for high-performance thermal management solutions

Product Overview

The Volsun 1-8W silicone thermal pad is a compressible, conformable thermal interface material optimized for CPU/GPU cooling and electronic component heat dissipation. Engineered for thermal conductivities ranging up to 8 W/m·K, this high voltage thermal pad bridges microscopic gaps between heat sources and heat sinks, improving thermal coupling while providing dielectric isolation where required. Manufactured under ISO9001 and IATF-quality processes, the ISO9001 thermal pad offers consistent thickness control, uniform thermal performance, and reliable mechanical characteristics for both prototype and high-volume production environments

Key Features

- High Thermal Conductivity: The silicone thermal pad offers thermal conductivity options up to 8 W/m·K, enabling efficient heat transfer from CPU/GPU cooling surfaces and power semiconductors to heat sinks or chassis

- Electrical Insulation for High Voltage: As a high voltage thermal pad, the material is formulated to maintain dielectric strength while transferring heat, making it suitable for power modules, inverters and other high-voltage assemblies

- Conformability and Compression: Soft yet resilient silicone matrix conforms to irregular surfaces and compensates for planarity variations between chips, packages and heat sinks. This ensures low thermal resistance at interface points in CPU/GPU cooling and general electronics

- Wide Operating Temperature Range: Designed to remain stable over broad temperature cycles, the silicone thermal pad preserves thermal conductivity and mechanical properties from sub-ambient to elevated operating conditions commonly found in computing and industrial applications

- UL and Regulatory Support: Produced in compliance with international quality standards, the ISO9001 thermal pad benefits from traceable manufacturing and quality control systems to support safety and regulatory demands

- Customizable Dimensions and Hardness: Available in various thicknesses, sheet sizes and duro-meters to suit specific designs—whether for CPU/GPU cooling, board-level thermal bridging or high-voltage insulation tasks

- Low Outgassing and Long-Term Reliability: The silicone matrix minimizes volatile migration and maintains long-term contact integrity to avoid performance degradation over device lifetimes

Applications

- CPU/GPU Cooling: The silicone thermal pad is optimized for CPU/GPU cooling in desktops, laptops, workstations and servers. Its high thermal conductivity and compressibility reduce operating temperatures, stabilize thermal throttling behavior, and maximize performance headroom

- Power Electronics and Motor Drives: As a high voltage thermal pad, it is ideal for IGBTs, MOSFETs, power modules and motor drive assemblies requiring both robust heat transfer and electrical isolation

- Telecom and Networking Equipment: Rack-mounted servers, switches and base-station modules benefit from improved thermal pathways created by the silicone thermal pad, enabling higher-density layouts and extended service life

- Automotive Electronics: Robust against vibration and thermal cycling, Volsun’s ISO9001 thermal pad supports electronic control units, battery management systems and inverters where reliable CPU/GPU cooling and power-device thermal management are critical

- Consumer Electronics and Industrial Controls: From high-performance gaming devices with intensive CPU/GPU cooling needs to industrial controllers and power supplies, the silicone thermal pad ensures consistent thermal performance

- LED Modules and Lighting: Heat-generating LEDs and drivers gain from the pad’s ability to transfer heat to heat sinks while maintaining electrical isolation when required

Innovation and Technical Advantages

Volsun leverages proprietary polymer compounding, filler dispersion and curing techniques to create a silicone thermal pad that balances thermal conductivity with mechanical compliance. The result is a product that minimizes interface thermal resistance while preserving dielectric strength for high-voltage applications. By optimizing filler morphology and distribution, Volsun achieves high thermal performance without sacrificing elasticity, allowing the pad to maintain intimate surface contact under variable clamping pressures common in CPU/GPU cooling assemblies

Quality-driven manufacturing ensures that each ISO9001 thermal pad meets strict dimensional tolerances and thermal performance specifications. Volsun’s factory-controlled processes reduce batch-to-batch variance, which is critical when integrating silicone thermal pads into automated assembly lines or precision thermal stacks. The company’s extensive patent portfolio and adherence to IATF 16949/ISO9001 reflect decades of polymer expertise and a commitment to continuous improvement

Installation and Handling

The silicone thermal pad is designed for straightforward integration: cut-to-fit sheets can be trimmed with standard tools, and pre-form options are available for automated placement. The material’s tack-free surface reduces contamination risk but still provides adequate adherence to maintain contact during assembly. For CPU/GPU cooling applications, the pad should be selected to match the gap thickness and clamping force to ensure optimal compression and thermal contact. For high voltage thermal pad use cases, designers should validate dielectric requirements and see page distances in conjunction with the pad’s electrical properties

Design Considerations

When selecting a silicone thermal pad, consider thermal conductivity, thickness, hardness and dielectric characteristics. Higher thermal conductivity values benefit high-power CPU/GPU cooling, while softer duro-meters ensure better conformity for uneven surfaces. For high voltage systems, choose the ISO9001 thermal pad variant that balances required dielectric strength with thermal performance. Volsun provides technical datasheets and application support to help engineers optimize pad selection based on system-level thermal simulations and physical prototyping

Why Choose Volsun

- Proven Experience: Founded in 2006, Volsun has specialized in polymer materials R&D and manufacturing for over a decade, serving 6,000 customers across 88 countries with OEM/ODM services

- Comprehensive Product Range: Alongside silicone thermal pads, Volsun produces cold/heat shrink tubes, fiberglass sleeves and other polymer-based thermal and insulation solutions, enabling system-level thermal and electrical integration

- Certified Quality: The ISO9001 thermal pad is produced under stringent quality systems, while IATF 16949 alignment supports automotive-grade applications

- Technical Support and Customization: Volsun’s R&D and production capabilities enable tailored formulations, custom dimensions and collaborative development for unique thermal challenges

The Volsun 1-8W silicone thermal pad for CPU/GPU and electronic components is a versatile, high-performance thermal interface engineered to meet the demands of modern computing, power electronics and industrial systems. Combining up to 8 W/m·K thermal conductivity, dielectric insulation for high-voltage applications, and ISO9001-grade manufacturing consistency, the high voltage thermal pad by Volsun delivers reliable CPU/GPU cooling, effective heat transfer and long-term stability. For engineers seeking a proven silicone thermal pad solution with global supply capabilities and technical backing, Volsun provides the materials expertise, certifications and application support to optimize thermal management across a wide range of products and industries